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ZKPI-6200 series is a low-temperature curing negative photosensitive polyimide product without NMP solvent. It is developed using organic solvents and cured at a temperature of 200-280 ℃. It has high temperature resistance, a wide process window, and excellent chemical resistance. Applied in the field of advanced packaging (RDL, WLP, FCCSP, FCBGA, 2.5D \ 3D).