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The ZKPI-6100 series of negative photosensitive polyimide products are composed of polyamide ester solution, developed with organic solvents, and belong to low-temperature curing polyimide coating adhesive. They have high glass transition temperature, high elongation, wide film thickness range, and excellent chemical resistance. Widely used in integrated circuit stress buffer layers and advanced packaging (BGA, CSP, FOP, 2.5D) and other fields.