.jpg)
.png "1(1).png")
On March 14, 2019, Shi Ying, an expert from the overall group of the National Science and Technology Major Project "Large scale Integrated Circuit Manufacturing Equipment and Complete Processes" (Project 02), Secretary General of the Supporting Industry Branch of the China Semiconductor Industry Association, and Secretary General of the Integrated Circuit Materials Alliance, led a team to conduct on-site research at Bomi Technology to understand the company's development situation. Li Mingxin, President of Bomi Technology Research Institute and Deputy General Manager of the company, and Wang Bing, Deputy General Manager of the company, accompanied the research.
Dean Li Mingxin introduced the company's development history, the development situation in the past two years, the opportunities and challenges it faces to the guests. He pointed out that Bomi Technology Co., Ltd. has signed a technical cooperation agreement with the Institute of Chemistry of the Chinese Academy of Sciences to fully support project technology research and development through technology investment. Due to research and development needs, the company has actively introduced imported equipment and outstanding foreign talents in the past two years. Currently, the company's R&D team includes 2 senior Japanese experts, 5 researchers with doctoral degrees, and 6 researchers with senior professional titles. As of now, the company has completed research and development investment of more than 20 million yuan, owned and invested more than 200 sets of internationally leading R&D testing equipment, and Bomi Technology is building a R&D and production base in Yanggu, Shandong. After the completion of the Yanggu Bomi project, it is expected to achieve a production capacity of 100 tons/year of photosensitive polyimide and 500 tons/year of liquid crystal alignment agent by 2020. Dean Li Mingxin also put forward the company's demands, stating that the company urgently needs to establish strategic alliances with leading companies in the semiconductor industry to promote the industrialization of PSPI. Accompanied by Dean Li Mingxin, Secretary General Shi Ying visited the company's laboratory, Class 10, Class 100, and Class 10000 clean rooms, as well as the evaluation line for photosensitive polyimide coating adhesive materials (coating adhesives).
Secretary General Shi Ying highly praised the construction of the PSPI and AAPI evaluation demonstration platform, talent introduction, high-end instrument introduction, research and development progress, and leapfrog progress in product performance of Bomi Technology. She encouraged Bomi Technology to take the opportunity of national strategic adjustment, improve product technology content through technological innovation, accelerate the research and development speed of PSPI for wafer level packaging. The Materials Alliance will work with member units to coordinate alliance technical resources, organize capable units to open up resources on the basis of cooperation, and hope to do some substantive work on the development of Bomi Technology. We hope that Bomi Technology Co., Ltd. will take the lead in achieving key technological breakthroughs in China, and its product performance will soon reach the same level as foreign products, breaking foreign monopolies and contributing to the national microelectronics industry.
This survey has strengthened communication between enterprises and integrated circuit material alliances, providing assistance for Bomi to gain a deeper understanding of the semiconductor industry and establish connections and cooperation with downstream customers in the semiconductor industry in the future.