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The ZKPI-5200 series of negative photosensitive polyimide products is a highly active polyamide ester solution developed by the company, developed using organic solvents for development. The cured film has excellent mechanical and electrical properties, excellent adhesion (to bottom filling, metal under bumps, metal wiring, smooth sidewalls, and compatibility with copper (no copper migration)). Widely used for insulation passivation and stress buffering of power chips (Schottky, fast recovery, IGBT, etc.).